XCVC1702-2HSINSVG1369
$17,399.78
XCVC1702-2HSINSVG1369
XCVC1702-2HSINSVG1369
Manufacturer: AMD
Manufacturer Product Number: XCVC1702-2HSINSVG1369
Package: 1369-BFBGA, FCBGA
Product Status: Active
Attributes:
Architecture: MPU, FPGA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: –
Operating Temperature: -40°C ~ 110°C (TJ)
Package / Case: 1369-BFBGA, FCBGA
Peripherals: DDR, DMA, PCIe
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
RAM Size: 256KB
Series: Virtex® UltraScale+™
Speed: 800MHz, 1.65GHz
Supplier Device Package: 1369-FCBGA (35×35)
| Architecture | MPU, FPGA |
|---|---|
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | – |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Package / Case | 1369-BFBGA, FCBGA |
| Peripherals | DDR, DMA, PCIe |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| RAM Size | 256KB |
| Series | Virtex® UltraScale+™ |
| Speed | 800MHz, 1.65GHz |
| Supplier Device Package | 1369-FCBGA (35×35) |
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